Semiconductor manufacturers require ultrapure water for the wafer fabrication process. As the features on wafers become smaller and more complex, it is critical that contaminants are kept to a minimum. Any extraneous particle can result in a defect, reducing the yield of the wafer. This also holds true as the completed wafer goes through a cleansing process. The primary contaminants of concern are organic compounds (TOCs) and ultrasmall metals particles. 

 

For the most control over water processing we recommend a distributed system as opposed to larger chambers. RefleX UV Chambers provide the most compact and efficient UV systems for breaking up TOCs that are then removed via a deionization process.  

 

RefleX UV Chambers are designed with the lowest metal contact surfaces of any UV system. We also offer the next step in the evolution of UV chambers – a fully metal-free RefleX UV Chamber.